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Double-Sided Mechanical Interlocking Enables Soft-Rigid Conductive Interfaces With a Record High Toughness for
Gang Li1,2, Minkun Cai3, Chunyan Cao4
1Nanotechnology Center, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong, China.
Advanced Materials (Deerfield Beach, Fla.)
|June 10, 2026
Summary
A novel mechanical interlocking strategy enhances electrical contacts between soft polymers and rigid metals. This robust method achieves record interfacial toughness, enabling stable hybrid electronic systems.
Area of Science:
- Materials Science
- Polymer Science
- Electrical Engineering
Background:
- Mismatches between polymeric electrodes and metallic components impede robust electrical contact formation.
- Existing solutions primarily use chemical design to improve interfacial interactions.
Purpose of the Study:
- To introduce a double-sided mechanical interlocking strategy for stable and adaptable polymer-metal electrical contacts.
- To overcome limitations of current chemical-based interfacial strengthening methods.
Main Methods:
- A conductive fabric scaffold was used to bridge polymers and metals.
- Adhesives were applied to both sides of the scaffold, infiltrating fibers to create thread-hole adhesion.
- Interfacial toughness was measured using peeling tests.
Main Results:
- Achieved a record interfacial toughness of 730 J m-2 between conductive elastomer and copper.
- Delamination occurred between the silver paste and copper, suggesting potential for higher toughness with improved adhesives.
- Interface stability exceeded electrode stability, remaining intact even after electrode failure.
Conclusions:
- The mechanical interlocking strategy offers a versatile platform for integrating soft and rigid conductors in hybrid electronic systems.
- The design is compatible with various elastomeric/hydrogel matrices and commercial adhesives.
- Enables reliable construction of epidermal electronics and hydrogel-based devices.
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