Hydrogen bond engineering for defect passivation and performance enhancement in the one-dimensional copper-based

Jiansen Wen1, Sencan Chen2, Linqin Jiang3

  • 1Materials Genome Institute, College of Materials Science and Engineering, Fuzhou University, Fuzhou 350108, China; Key Laboratory of Green Perovskites Application of Fujian Province Universities, Fujian Jiangxia University, Fuzhou 350108, China.

Abstract