E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces

High-density thin-film neural interfaces face persistent packaging challenges at the electrode-electronics interface, where conventional rigid connectors impose high insertion forces, strict alignment requirements, and limited reusability. We present E-Link (Elastomeric Link), a modular 256-channel mini-pedestal connector designed to facilitate simplified, user-friendly assembly through an insertion-free, alignment-tolerant interface utilizing an elastomeric conductive interposer and a compliant threaded compression mechanism. Finite element analysis and experimental validation confirm uniform contact stress across the 16 × 16 interconnect array. The system achieves stable electrical performance, exhibiting contact impedances of 0.3-0.4 kΩ, an RMS noise floor of 2.68 ± 0.46 μV, and a connection yield exceeding 97% over 100 mating cycles. The detachable architecture reduces chronic head-mounted mass from 6.6 g to 2.8 g while maintaining safe thermal operation (30.5 °C steady-state) under a full 20 kHz sampling bandwidth. Design analysis further indicates scalability toward 1024-channel integration within the same 25-mm-diameter footprint by leveraging fine-pitch elastomeric conductive pillars. This work provides a robust and scalable connection solution for high-density flexible neural interfaces with broad application for bioelectronics.