Hierarchically Biporous Wick Vapor Chamber With Micro/Nano Condenser for Exceeding 600 W/cm² Heat Dissipation

Area of Science:

• Materials Science
• Thermal Engineering
• Nanotechnology

Background:

• High-power electronics demand efficient thermal management to prevent performance degradation.
• Conventional vapor chambers face limitations in liquid supply and condensate return, hindering their use in advanced electronics.

Purpose of the Study:

• To develop an enhanced vapor chamber for high heat flux dissipation.
• To overcome the limitations of traditional vapor chambers for next-generation electronics.

Main Methods:

• Incorporation of a hierarchically biporous superhydrophilic evaporator wick for improved capillary-driven liquid supply.
• Development of a superhydrophobic micro/nano-structured condenser surface for dropwise condensation and efficient condensate return.

Main Results:

• Achieved a minimum overall thermal resistance of approximately 0.17°C/W.
• Demonstrated a minimum thermal resistance of temperature uniformity of approximately 0.02°C/W.
• Exceeded a critical heat dissipation flux of 600 W/cm², even under gravity-opposed conditions.

Conclusions:

• The synergistic design of the enhanced vapor chamber ensures continuous and efficient liquid supply.
• The developed vapor chamber shows significant performance enhancement compared to previous designs.
• This work offers a promising solution for extreme heat flux dissipation in next-generation high-power electronics.