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Updated: Jun 13, 2026

10:31
Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors
Published on: November 24, 2016
Review of the Gate Structure for Normally Off p-GaN High-Electron-Mobility Transistors Towards High Performances
Taofei Pu1, Xiaobo Li2, Liuan Li3
1School of Automation and Electrical Engineering, Shenyang Ligong University, Shenyang 110159, China.
Materials (Basel, Switzerland)
|June 12, 2026
Summary
Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) with a p-GaN gate enable normally off operation for power electronics. This review details p-GaN gate structures and fabrication for enhanced performance.
Area of Science:
- Materials Science
- Semiconductor Physics
- Power Electronics
Background:
- Gallium nitride (GaN) is a wide-bandgap semiconductor with superior properties for power electronics.
- AlGaN/GaN heterostructures are key for achieving normally off operation.
- p-GaN gate HEMTs are a focus for commercial power applications.
Purpose of the Study:
- To review the necessity of normally off operation in GaN HEMTs.
- To elaborate on the advantages and theory of p-GaN gates.
- To discuss various gate structures and optimization methods for p-GaN gate HEMTs.
Main Methods:
- Review of existing literature on p-GaN gate HEMTs.
- Analysis of different gate structures (metal, junction, hybrid) on the p-GaN layer.
- Discussion of fabrication processes and optimization strategies for threshold and breakdown voltage.
Main Results:
- p-GaN gates are crucial for achieving normally off operation in AlGaN/GaN HEMTs.
- Gate structure design significantly impacts threshold voltage.
- Optimization methods can enhance breakdown voltage and enable monolithic integration.
Conclusions:
- p-GaN gate HEMTs are vital for next-generation power systems.
- Further research into gate structures and fabrication is needed for improved performance.
- This technology holds promise for advanced power electronics.
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