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The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
Published on: December 5, 2025
Surface-Modified InVGr as a Thermal Interface Material with High Thermal Conductivity and Low Contact Thermal
Yisimayili Tuersun1, Wenmei Luo2, Junfeng Zhao3
1Department of Physics, Southern University of Science and Technology, Shenzhen 518055, China.
ACS Applied Materials & Interfaces
|June 15, 2026
Summary
A new indium/vertical graphite (InVGr) composite material offers superior thermal conductivity for high-power electronics. Surface modification with liquid metal (LM) significantly reduces thermal resistance, enhancing heat dissipation for advanced devices.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- High-power electronics require efficient thermal interface materials (TIMs) for heat dissipation.
- Conventional polymer TIMs exhibit low thermal conductivity and high contact resistance, hindering performance.
- Rapid advancements in AI and power semiconductors necessitate improved thermal management solutions.
Purpose of the Study:
- To develop a novel composite TIM with enhanced thermal conductivity and reduced contact resistance.
- To investigate the efficacy of an indium/vertical graphite (InVGr) composite material.
- To optimize heat dissipation for high-energy-density electronic devices.
Main Methods:
- Fabrication of an indium/vertical graphite (InVGr) composite material.
- Surface modification using low-melting-point InBiSn liquid metal (LM).
- Measurement of thermal conductivity and contact thermal resistance under pressure.
- Experimental validation of heat dissipation performance in a practical setup.
Main Results:
- The InVGr composite achieved a high thermal conductivity of 220.2 W/m·K.
- Liquid metal surface modification reduced contact thermal resistance to 0.09 cm²·K/W at 100 psi.
- The LM/InVGr/LM composite decreased heat source temperature from 113.3 °C to 55.5 °C.
- Demonstrated superior cooling efficiency compared to commercial silicone and carbon fiber pads.
Conclusions:
- The surface-modified InVGr composite is a highly effective TIM for advanced electronics.
- This material offers a novel solution for the thermal management challenges in high-power devices.
- The developed composite significantly improves heat dissipation capabilities, enabling higher device performance and reliability.
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