Morphology-controlled copper nanostructures: synthesis, anti-oxidation strategy, and applications

Copper nanostructures exhibit significant application potential in electronics, energy, catalysis, and biomedicine due to their excellent electrical and thermal conductivity, catalytic activity, and antibacterial properties. However, their high surface reactivity causes them to readily oxidize, forming an insulating copper oxide layer that severely compromises their performance. This oxidation represents a key bottleneck limiting their practical use. This review systematically summarizes chemical synthesis strategies for Cu nanostructures with various morphologies (such as spheres, wires, cubes, flakes, and rod-shaped structures). It delves into strategies for enhancing their oxidation resistance, primarily including metallic coating (e.g., Ag and Ni), organic molecule modification, and surface modification. Furthermore, the review outlines the recent progress in the application of differently shaped Cu nanostructures in conductive inks for flexible electronics and as efficient catalysts. It emphasizes the critical role of morphology control and oxidation resistance in determining their final performance. Finally, future directions for developing high-performance, highly stable Cu nanostructures and their application prospects are discussed.