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Related Experiment Video

Updated: Jun 19, 2026

Structural Design and Manufacturing of a Cruiser Class Solar Vehicle

Structural Design and Manufacturing of a Cruiser Class Solar Vehicle

Published on: January 30, 2019

Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal

Hongxiu Wu^1,2, Guangyan Cheng^1,2, Qiang Liu^1,2

¹State Key Laboratory of Cryogenic Science and Technology, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, P. R. China.

|June 18, 2026

Summary

This summary is machine-generated.

Researchers developed novel dual-shell hollow microspheres combining lightweight, high strength, tunable electrical conductivity, and low thermal conductivity for advanced electronics. These multifunctional materials offer superior microwave attenuation and thermal regulation.

Keywords:

electrical conductivity infrared emissivity microwave management thermal conductivity thermal management

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Last Updated: Jun 19, 2026

Structural Design and Manufacturing of a Cruiser Class Solar Vehicle

Structural Design and Manufacturing of a Cruiser Class Solar Vehicle

Published on: January 30, 2019

Area of Science:

Materials Science
Nanotechnology
Condensed Matter Physics

Background:

Modern electronics demand multifunctional materials for lightweight, high-frequency, and integrated designs.
Existing materials face trade-offs between electrical conductivity, thermal insulation, mechanical strength, and lightweight properties.
Need for materials combining microwave and thermal management with mechanical load-bearing capacity.

Purpose of the Study:

To overcome inherent material property trade-offs by designing novel multifunctional hollow microspheres.
To achieve synergistic integration of lightweight, high strength, electrical conductivity, thermal insulation, and tunable infrared emissivity.
To develop materials for advanced microwave attenuation and thermal regulation in electronic devices.

Main Methods:

Fabrication of heterogeneous dual-shell hollow microspheres (DSHM) using glass (dielectric) and copper (conductive) shells.
Optimization of dielectric-to-conductive phase ratio, shell microstructure, and macroscopic structural parameters.
Characterization of mechanical properties (density, compression survival rate), thermal conductivity, electrical conductivity, and infrared emissivity.

Main Results:

Achieved a synergistic combination of lightweight (0.4456-1.0991 g cm⁻³) and high strength (87.1% survival under 2 MPa uniaxial compression).
Integrated low thermal conductivity (0.1134-0.1478 W m⁻¹ K⁻¹) with broadly tunable electrical conductivity (299.6-2625.7 S cm⁻¹).
Successfully controlled infrared emissivity (0.218-0.493) within a single microsphere structure.

Conclusions:

The developed DSHM exhibit exceptional microwave attenuation and thermal regulation performance.
These findings pave the way for multifunctional materials in next-generation electronic devices.
The novel design overcomes traditional material property limitations for advanced applications.