Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping

To meet the growing demand for materials combing high thermal conductivity and electrical insulation, we developed epoxy (EP) composites filled with zero-dimensional (0D) silver nanoparticles (AgNPs) and two-dimensional (2D) boron nitride nanosheets (BNNSs). This hybrid filler system synergistically enhances both thermal conductivity and dielectric properties, while retaining excellent electrical insulation. With only 1 wt% AgNPs and 15 wt% BNNSs, the composite achieved a dielectric constant of 4.17 at 100 Hz, outperforming pure EP. At 30 wt% BNNSs and the same AgNP loading, the in-plane and out-of-plane thermal conductivities reached 3.02 and 0.41 W·m^-1·K^-1, respectively, along with improved thermal stability. Moreover, the composite exhibited an electrical conductivity below 10^-9 S/cm at 1000 Hz, confirming that the minimal metal filler content negligibly affects insulation. Thus, this work offers a feasible strategy for designing next-generation high-performance composites using 0D/2D hybrid fillers, highlighting their promising potential for advanced electronic packaging.