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An Integrated Physics-Based and Data-Driven Framework for Defect Prediction in Advanced Nanoimprint Lithography

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This study introduces a physics-based and data-driven framework for predicting defects in nanoimprint lithography (NIL). The approach enables virtual inspection of semiconductor designs before manufacturing to identify potential yield risks.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Manufacturing

Background:

  • Advanced nanoimprint lithography (NIL) offers high-resolution semiconductor patterning but faces yield loss due to accumulated distortions.
  • Defects in NIL arise from complex interactions during coating, exposure, etching, and imprinting processes.

Purpose of the Study:

  • To develop an integrated framework for pre-manufacturing defect-risk prediction in NIL.
  • To enable early identification and mitigation of yield risks in advanced semiconductor fabrication.

Main Methods:

  • An integrated framework combining a physics-based process twin and a data-driven risk prediction model (physics-augmented CNN with conformal uncertainty calibration).
  • Utilizing an NDA-safe layout database and simulating sequential process steps: spin coating, electron-beam lithography (EBL), reactive ion etching (RIE), and imprinting.
Keywords:
defect predictionelectron-beam lithography (EBL)nanoimprint lithography (NIL)physics-augmented convolutional neural networkphysics-based process twinreactive ion etching (RIE)uncertainty calibrationvirtual inspection

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  • Generating physically consistent parameter maps from design layouts for downstream machine learning.
  • Main Results:

    • Demonstrated an end-to-end virtual inspection flow converting layouts into spatially resolved risk maps prior to fabrication.
    • Revealed that local pattern density significantly influences risk distribution, beyond nominal geometry.
    • Highlighted the importance of the local pattern environment in governing manufacturability.

    Conclusions:

    • The proposed framework provides a physically interpretable method for early yield-risk screening in advanced NIL.
    • Pre-manufacturing virtual inspection is crucial for optimizing semiconductor fabrication processes.
    • Understanding pattern environment interactions is key to improving NIL yield and reliability.