Capacitive Sensors and Actuators by CMOS MEMS Foundry

This article introduces the current status of the 0.18-micron CMOS MEMS foundry service platform provided by the Taiwan Semiconductor Research Institute (TSRI), extensively covering the CMOS MEMS components that it has supported in development and fabrication. It also attempts to expand the foundry service scope to the broader categories of capacitive sensors and electrostatic actuators. On the one hand, for fabless MEMS component designers, TSRI currently directly allows the design of two types of components: flow sensors with uniformly perforated membranes and actuators with comb-shaped interdigital electrodes. This service also includes tape-out and wire bonding packaging procedures, following procedures similar to those used by general IC designers. On the other hand, this article specifically presents a clear and feasible approach for MEMS designers equipped with simple wet-etching facilities and a clear and feasible approach to develop further CMOS MEMS components such as capacitive pressure sensors, accelerometers, micro mirrors, and scratch drive actuators with minimal post-processing and chip packaging steps. This work provides a practical CMOS-MEMS design and post-processing guideline for extending the current TSRI foundry platform toward capacitive sensing and electrostatic actuation applications with minimal additional fabrication complexity.