Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components

Multi-field coupled numerical analysis and strain monitoring experiments were conducted for the curing process of a ring-shaped CFRP component. The curing kinetics and mechanical properties of LD-2184 epoxy resin were characterized using non-isothermal DSC, tensile testing, and CTE measurements. The curing reaction follows a single-stage autocatalytic mechanism with an activation energy of 54.73 kJ·mol^-1. A piecewise curing kinetics equation was established. The elastic modulus of the fully cured resin is 2.810 GPa, and the coefficient of thermal expansion is 6.060 × 10^-5 K^-1. Composite ring specimens were fabricated using a wet winding process. FBG sensors were embedded to monitor axial strain during curing. A coupled numerical model was developed that includes heat conduction, curing kinetics, and curing deformation. ABAQUS was used to simulate the curing process of the composite ring. The results show a temperature gradient within the filament-wound layer. Thermo-chemical strain is similar between inner and outer regions. Total strain varies along the thickness due to mold constraint. Residual stress is governed by resin chemical shrinkage and thermal contraction during cooling. The difference between measured and simulated strain is 7.15%, which supports the validity of the multi-field coupled curing model.