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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
Published on: January 17, 2017
Amal Alliyankal Vijayakumar1, Francesca Lionetto1, Alfonso Maffezzoli1
1Department of Engineering for Innovation, University of Salento, Via per Monteroni, 73100 Lecce, Italy.
This review assesses experimental methods for characterizing Mode I debonding in polymer sandwich structures. It highlights limitations of standard tests and suggests improved setups for accurate fracture toughness evaluation.
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