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Updated: Jun 30, 2026

Negative Additive Manufacturing of Complex Shaped Boron Carbides
Published on: September 18, 2018
Three-Dimensional Printing Ultrastrong, Ultraductile Micro/nano Silicon Oxycarbide Ceramics Derived from a Monolithic
Gan Luo1, Yuan Tao1, Jincheng Ni1
1CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei230027, China.
Abstract:
Polymer-derived ceramics (PDCs) are promising candidates for fabricating three-dimensional (3D) micro/nanodevices. However, their advancement has been constrained by a persistent challenge in that precursor simplicity, high-fidelity shaping of complex 3D architectures, and superior mechanical properties in the final ceramic are incompatible. To overcome this, an extremely simple photosensitive preceramic resin comprising only polycarbosilane and a photoinitiator is proposed to fabricate high-precision 3D PDC microstructures with intricate geometries and exceptional mechanical performance. A process involving prebaking and two-photon polymerization forms stable 3D preceramic polymer networks, which after pyrolysis yield defect-free amorphous SiOC ceramics exhibiting high shape fidelity and low linear shrinkage (28% at 1000 °C). The ceramics show temperature-dependent mechanical properties, with micropillar compressive strength reaching 6.41 GPa (1000 °C) and 7.55 GPa (1200 °C). Leveraging these properties, lightweight high-strength mechanical metamaterials with 20% relative density are fabricated, achieving a compressive strength of 0.54 GPa and a failure strain exceeding 10%. Functional microneedle arrays are also produced, highlighting their potential for biomedical applications. This work establishes a reliable and straightforward route from an extremely simple precursor to high-performance PDC micro/nano devices, showcasing promising prospects for applications in advanced microsystems and lightweight metamaterials.

