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Performance Evaluation of Boiling Chamber With Enhanced Boiling and Condensing Surfaces for Efficient Warm Water
Nooruldeen Essam Mustafa1, Satish G Kandlikar2,3
1Department of Mechanical Engineering, Rochester Institute of Technology, Rochester, NY 14623.
ASME Journal of Heat and Mass Transfer
|June 30, 2026
Summary
This study demonstrates an enhanced boiling chamber for effective cooling of computer substrates. The novel design achieves high heat flux dissipation, enabling warmer coolant temperatures and reducing data center water usage.
Area of Science:
- Thermal Engineering
- Heat Transfer
- Data Center Cooling
Background:
- Traditional cooling methods struggle with high heat loads from modern electronics.
- Efficient heat dissipation is critical for maintaining the performance and longevity of computer substrates.
- Data centers face challenges with high energy consumption and water usage for cooling.
Purpose of the Study:
- To investigate the performance of an enhanced boiling chamber for cooling computer substrates.
- To evaluate the impact of fill ratios on the boiling chamber's heat dissipation capabilities.
- To assess the feasibility of using higher coolant inlet temperatures for data center cooling.
Main Methods:
- Integration of boiling and condensation within a boiling chamber.
- Utilization of a finned tube condenser with a surface area of 48,440 mm².
- Testing with fill ratios of 40% and 80% and varying coolant inlet temperatures.
Main Results:
- The enhanced finned tube condenser significantly improved boiling chamber performance.
- High heat fluxes (up to 178 W/cm²) were dissipated within substrate temperature limits.
- Effective cooling was achieved even at elevated coolant inlet temperatures (e.g., 40°C).
Conclusions:
- The enhanced boiling chamber offers superior heat dissipation for computer substrates.
- The system enables higher coolant inlet temperatures, supporting dry cooling towers and reducing water consumption.
- The compact design is suitable for practical implementation in data center cooling infrastructure.
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