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Updated: Jul 1, 2026

A Fabrication and Measurement Method for a Flexible Ferroelectric Element Based on Van Der Waals Heteroepitaxy
Published on: April 8, 2018
Reconfigurable Logic-in-Memory Oxide Transistors Enabled by Transferable Ferroelectric HZO.
Chang-Chang Huang1, Bo-Cia Chen2,3, Hao-Tse Lee1
1Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu 300093,Taiwan.
Advanced membrane transfer techniques enable interface-layer-free integration of ferroelectric hafnium zirconium oxide (HZO) with indium oxide (In2O3) channels. This breakthrough enables stable, high-performance logic-in-memory devices compatible with semiconductor manufacturing.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Indium oxide (In2O3) shows promise for logic-in-memory (LOM) applications due to high electron mobility and low-temperature processing.
- Direct integration of high-κ ferroelectrics like hafnium zirconium oxide (HZO) with In2O3 degrades interfaces, causing device instability.
- Existing methods face challenges with chemical incompatibilities and interfacial defects.
Purpose of the Study:
- To develop an interface-layer-free integration method for ferroelectric HZO and In2O3 channels.
- To demonstrate the feasibility of using advanced membrane transfer techniques for LOM devices.
- To create stable and high-performance dual-gate ferroelectric In2O3 transistors and reconfigurable logic circuits.
Main Methods:
- Utilized advanced membrane transfer techniques to deposit a ferroelectric HZO layer onto In2O3 channels.
- Formed a van der Waals-like junction with an approximate 0.8 nm interfacial gap, preserving In2O3 stoichiometry.
- Fabricated dual-gate ferroelectric In2O3 transistors and integrated them into inverter circuits.
Main Results:
- Achieved interface-layer-free integration, avoiding chemical incompatibilities and preserving In2O3 channel quality.
- The transferred HZO exhibited a dielectric constant of 26 and low leakage current (<10^-7 A cm^-2 at 1 MV cm^-1).
- Demonstrated dual-gate ferroelectric In2O3 transistors with a large memory window, stable endurance (>10^9 cycles), and reconfigurable NOR/NAND logic functions.
Conclusions:
- The membrane transfer method provides a viable route for integrating ferroelectric HZO with In2O3 for LOM applications.
- This approach overcomes interfacial degradation issues, leading to enhanced device performance and stability.
- The process is compatible with silicon back-end-of-line thermal budgets and scalable for wafer-level integration, paving the way for high-density, multifunctional LOM architectures.
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