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Intimate encapsulation of non-planar electrodes via a viscoplastic interlayer.

Liqian Liu1, Xinyue Xiang1, Yinglin Zhi1

  • 1Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.

National Science Review
|July 3, 2026
PubMed
Summary

A novel viscoplastic interlayer ensures hermetic encapsulation for implantable electronics with non-planar electrodes. This breakthrough improves device longevity and signal stability in challenging environments.

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Area of Science:

  • Materials Science
  • Biomedical Engineering
  • Polymer Science

Background:

  • Implantable electronics require non-planar electrodes for conductivity and deformability.
  • Conventional elastic seals fail with non-planar electrodes, causing voids and fluid ingress.
  • Hermetic encapsulation is crucial for long-term stability of implantable devices.

Purpose of the Study:

  • To develop a viscoplastic interlayer for hermetic encapsulation of non-planar electrodes.
  • To address the challenge of interfacial voids and fluid ingress in implantable electronics.
  • To enhance the long-term stability and signal fidelity of bioelectronic devices.

Main Methods:

  • Fabrication of a polymeric composite interlayer using polyisobutylene and maleic anhydride-grafted polypropylene.
  • Characterization of the interlayer's viscoplastic properties, including chain slippage and disentanglement.
  • Integration of the interlayer with various non-planar electrodes (microwires, micropillars, serpentine) and sealing elastomers.
  • Evaluation of encapsulation effectiveness through fluid ingress tests and stability assessments in acidic, neutral, and alkaline solutions.
  • Assessment of in vivo signal fidelity duration for stretchable bioelectronics.

Main Results:

  • The viscoplastic interlayer successfully adapted to 3D non-planar electrode structures, achieving intimate contact.
  • Defect-free interfaces were formed between the interlayer, elastomer, and electrodes via covalent bonding.
  • The encapsulated devices maintained a stable signal-to-noise ratio for 50 weeks in various solutions.
  • In vivo signal fidelity was extended to a record 45 weeks for stretchable bioelectronics.

Conclusions:

  • The developed viscoplastic interlayer provides effective hermetic encapsulation for non-planar electrodes.
  • This innovation significantly improves the long-term operational stability of implantable bioelectronic devices.
  • The interlayer offers a promising solution for enhancing the reliability and duration of bioelectronic implants.