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Updated: Jul 10, 2026

Bridging the Bio-Electronic Interface with Biofabrication
Published on: June 6, 2012
A multifunctional porous interface bridging 3D architected electronics with skin
Zhangming Shen1,2, Xu Cheng1,3, Xiaobin Luo4
1Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.
Abstract:
Skin-integrated flexible electronics are rapidly advancing from short-term use to continuous, long-term wear to meet the demands of health monitoring, wound healing, and skin disease treatment. While three-dimensionally (3D) architected devices offer sensing capabilities and outstanding mechanical performances, the development of a conformal interface between these 3D electronic devices and skin for long-term comfortable wear remains challenging due to their geometric complexity and mechanical fragility. Here, we introduce a multifunctional porous interface that bridges 3D flexible electronics with skin through engineered microporous networks. Such a porous design enhances elastic stretchability and electrical reliability while providing moisture permeability, thermal buffering, impact mitigation, and drug delivery capability. Stiffness reduction and localized pore-wall-shell buckling synergistically underpin the outstanding mechanical resilience under large deformations. The proposed multifunctional porous interface allows development of a 3D closed-loop wound administration patch capable of multimodal sensing and on-demand therapy, markedly accelerating scald wound healing in vivo.