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Multilayer Soft PCBs via Laser Patterning and Solvent-Assisted Interface Engineering.

Denis Rocha^1,2, Pedro Lopes^1,2, Paulo Peixoto²

¹Soft and Printed Microelectronics Lab, University of Coimbra, Coimbra, Portugal.

|July 10, 2026

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Researchers developed a novel fabrication platform for high-resolution, multilayer soft-printed circuit boards (soft-PCBs). This scalable process integrates microchips and enables advanced soft-matter electronics for diverse applications.

Area of Science:

Materials Science and Engineering
Soft Matter Physics
Microfabrication Technologies

Background:

Soft-matter electronics hold promise for digital health, soft robotics, and interactive systems.
Current fabrication methods lack PCB-like resolution, reliable microchip integration, and multilayer capabilities while maintaining mechanical compliance.

Purpose of the Study:

To present a scalable fabrication platform for high-resolution, multilayer soft-printed circuit boards (soft-PCBs).
To enable reliable microchip integration and multilayer interconnects in soft electronics.

Main Methods:

Development of a platform combining solvent-mediated interfacial engineering, laser-assisted patterning (down to ~25 µm), and laser-assisted VIA formation.
Introduction of Vapor-Assisted MicrochiP Integration and layER fusion (VAMPIER) for microchip attachment and multilayer lamination.

Keywords:

laser patterning liquid metal multilayer circuits solvent‐assisted soldering stretchable electronics

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Utilization of solvent-induced interfacial softening (SolBond, SolSolder) and biphasic liquid-metal composites for bonding and conductivity.

Main Results:

Achieved high-resolution, multilayer soft-PCBs with feature sizes down to ~25 µm.
Demonstrated reliable microchip integration and multilayer interconnects using the VAMPIER process without thermal soldering.
Fabrication performed below 60°C, ensuring compatibility with soft polymers and surface-mount devices.

Conclusions:

The developed platform enables the creation of multilayer, microchip-integrated soft-PCBs with resolution and density comparable to rigid PCBs.
The soft-PCBs exhibit superior mechanical resilience and sustainability.
This advancement facilitates the translation of soft-matter electronics from laboratory to practical applications.