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Updated: Jul 12, 2026

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Conformable Wearable Electrodes: From Fabrication to Electrophysiological Assessment
Published on: July 22, 2022
Bioinspired Ionic Biogels for Conformal On-Skin Wearable Bioelectronics.
Xiaoliang Zou1, Mengmeng Gou1, Xiaodong Zhang1
1College of Chemistry and Materials, Weinan Normal University, Weinan 714099, China.
ACS Applied Materials & Interfaces
|July 10, 2026
Summary
Researchers developed a novel thermoresponsive ionic biogel inspired by sea cucumbers. This adaptable gel forms in situ on skin, improving adhesion and signal transmission for wearable bioelectronics.
Area of Science:
- Materials Science
- Biomedical Engineering
- Polymer Chemistry
Background:
- Conductive gels are crucial for on-skin wearable bioelectronics due to their flexibility and conductivity.
- Conventional gels struggle with skin's complex, dynamic surface, hindering adhesion and signal quality.
Purpose of the Study:
- To create an in situ formable conductive gel with enhanced skin adhesion and signal performance.
- To mimic sea cucumber's reversible mechanical switching for adaptive bioelectronic interfaces.
Main Methods:
- Developed a thermoresponsive ionic biogel (IBG) using gelatin, water, and an ionic liquid.
- Utilized gelatin's reversible sol-gel transition and ionic liquid for conductivity and network modulation.
- Investigated IBG's mechanical, adhesive, and electrical properties, including strain sensing and signal acquisition.
Main Results:
- The IBG can be coated in a flowable state and gels in situ on the skin.
- Optimized IBG43 demonstrated low modulus, high stretchability, and strong skin adhesion.
- Achieved stable strain sensing, reliable electrophysiological signal acquisition, and potential for self-powered sensing.
Conclusions:
- The developed IBG offers a simple and effective strategy for skin-interfaced bioelectronic materials.
- In situ gelation provides a soft, adaptive, and ion-conductive interface superior to preformed gels.
- This material advances wearable bioelectronics through improved adhesion and signal integrity.

