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Updated: Jul 15, 2026

A Micropatterning Assay for Measuring Cell Chirality
Published on: March 11, 2022
Chirality-sensitive defect localization in helical nanoparticle assemblies via generalized Mie scattering polarimetry
Mengyao Jing1, Xingcai Li2, Juan Wang2,3
1School of Electronic and Electrical Engineering, Ningxia University, Yinchuan 750021, China.
Abstract:
Chiral helical nanoparticle assemblies are promising for photonics and biosensing, but self-assembly defects compromise reliability. Conventional defect detection typically relies on invasive electron microscopy, which falls short of the requirements for rapid, non-destructive quality control. In this work, we establish a generalized-Mie-theory-based quantitative framework that links point defect geometry to far-field polarization responses via scattering polarimetry. For a 15-particle SiO2 helical chain containing two representative defect prototypes-vacancy (Type A) and relaxed vacancy (Type B)-we find that local symmetry breaking selectively perturbs the collective eigenmodes, yielding pronounced and position-dependent scattering signatures. The backscattering cross section (BCS) reveals that a defect at the chain center induces exceptionally strong resonance peaks at specific incident angles (30°, 70°, and 90°), distinctly different from those of end-located defects or the perfect structure. Multipole decomposition reveals order-selective relative changes in scattering power, confirming that defects induce mode redistribution rather than uniform attenuation. The Mueller matrix element M14 in the forward scattering region (0°-30°) offers discriminative fingerprints via oscillation amplitudes, extrema, and waveform topologies (V, S, M, N, C, and L). Under particle-size polydispersity of ±5%, center-defect fingerprints remain clearly distinguishable and most robust. Our findings move beyond viewing defects as mere imperfections, establish a direct link from defect configuration to polarization response, and provide a theoretical foundation for non-invasive inspection of self-assembled photonic devices.
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