Related Experiment Video
Updated: Aug 6, 2026

Scalable Quantum Integrated Circuits on Superconducting Two-Dimensional Electron Gas Platform
Published on: August 2, 2019
Large band curvature in semimetal-semiconductor NbSe2/WSe2 heterojunctions for high-speed imaging
Yan Zhou1, Wei Shangguan1, Huihui Yu1
1Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China; Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory of Two-Dimensional Semiconductors for Future Chips, University of Science and Technology Beijing, Beijing 100083, China.
Abstract:
High-speed imaging relies on tunable interfacial band bending for carrier separation and collection almost instantaneously, which can be severely affected by finite barrier heights and Fermi-level pinning. Here, we report a large-curvature van der Waals heterojunction (LCVH) formed by the two-dimensional (2D) semimetal 2H-NbSe2 and 2D semiconductor WSe2, featuring a steep band structure. The interfacial barrier is increased by the semimetal's high work function, while Fermi-level pinning is weakened by its low interface-state density, enabling effective control of band bending. With this interfacial modulation, the LCVH exhibits an ultralow dark current of 8.62 × 10-15 A, a light-to-dark current ratio of 105, and fast photoresponse times of 6.12/4.69 μs. Furthermore, a high-speed visible-light imager is realized using the LCVH detector. Compared to conventional metal-semiconductor junctions, the semimetal-semiconductor heterojunction achieves a fourfold increase in detection bandwidth over the conventional metal-semiconductor structure without sacrificing signal-to-noise ratio. This work provides an effective interfacial band-engineering strategy for high-speed imaging in 2D optoelectronic devices.

