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Updated: Aug 6, 2026

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Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Development of a Pixelated STEM-In-SEM Detector for Microstructural Feature Characterization
Julien Aubourg1,2, Emmanuel Bouzy2, Jean-Jacques Fundenberger2
1JEOL (Europe) SAS, Croissy, France.
Microscopy Research and Technique
|July 23, 2026
Summary
A new Scanning Transmission Electron Microscopy in a Scanning Electron Microscope (STEM-in-SEM) detector enables Transmission Electron Microscopy-like analysis within a Scanning Electron Microscope. This technique allows for detailed microstructural characterization, including imaging defects and dislocations.
Area of Science:
- Materials Science
- Electron Microscopy
- Solid State Physics
Background:
- Traditional Transmission Electron Microscopy (TEM) requires specialized equipment and sample preparation.
- Scanning Electron Microscopes (SEM) offer greater accessibility but have limitations in high-resolution microstructural analysis.
- Bridging the gap between SEM and TEM capabilities is crucial for advanced materials characterization.
Purpose of the Study:
- To introduce and evaluate a novel Scanning Transmission Electron Microscopy in a Scanning Electron Microscope (STEM-in-SEM) detector prototype.
- To demonstrate the feasibility of performing TEM-like analyses within an SEM environment.
- To assess the capabilities and limitations of the developed detector for microstructural characterization.
Main Methods:
- Development of a detector incorporating a digital micromirror device (DMD) for user-defined apertures.
- Integration of an On-Axis Transmission Kikuchi Diffraction (On-Axis TKD) geometry for rapid diffraction pattern acquisition.
- Utilizing adjustable bright-field and dark-field imaging conditions.
Main Results:
- The detector successfully generated user-defined apertures, enabling TEM-like characterizations with minimized artifacts.
- High signal-to-noise ratio diffraction patterns were acquired rapidly using the On-Axis TKD geometry.
- Microstructural defects, including dislocations visualized via diffraction contrast, were imaged under various imaging conditions.
Conclusions:
- The Pixelated STEM-in-SEM technique effectively transfers TEM capabilities to SEM.
- The developed detector provides a versatile platform for microstructural defect analysis in thin foils.
- This approach enhances the analytical power of SEM for materials science research.
Keywords:
bright‐field imagingdark‐field imagingdiffractiondigital micromirror device (DMD)microstructural characterizationscanning electron microscope (SEM)scanning transmission electron microscopy (STEM)
