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High-Enthalpy Solid-Solid Phase Change Composite Constructed From Physical Entanglements for Multimodal Thermal
Zijin Yan1, Guang Chen1, Zhi Li1
1School of Materials Science and Engineering, Key Laboratory of Advanced Civil Materials of Ministry of Education, Tongji University, Shanghai, P. R. China.
Small (Weinheim an Der Bergstrasse, Germany)
|July 23, 2026
Summary
This study introduces a novel solid-solid phase change material (PCM) composite using physical entanglement and carbon nanotubes. It offers high energy storage, efficient photo/electro-thermal conversion, and strain sensing for advanced thermal management.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Advanced equipment requires thermal management materials with high energy storage and active regulation.
- Solid-liquid PCMs face leakage issues, and chemical cross-linking reduces heat storage capacity.
Purpose of the Study:
- To develop a multifunctional solid-solid PCM composite overcoming limitations of existing materials.
- To achieve high energy storage, efficient thermal conversion, and sensing capabilities.
Main Methods:
- A folding-hot-pressing process based on physical chain entanglement of ultrahigh-molecular-weight PEG (HPEG) and low-molecular-weight PEG (LPEG).
- Synergistic coupling with carbon nanotubes (CNTs) to form conductive networks.
- Characterization of phase-change enthalpy, photo/electro-thermal conversion efficiency, and strain-sensing properties.
Main Results:
- A solid-solid PCM composite with high phase-change enthalpy (158.0 J g⁻¹).
- Efficient photo/electro-thermal conversion efficiencies (92.1% and 91.2%).
- Demonstrated shape programmability, elasticity, and strain-sensing capability (GF of 1.36).
Conclusions:
- The developed composite effectively suppresses liquid leakage while retaining energy storage.
- The material integrates passive heat storage, active heating, and motion monitoring for adaptable thermal management.
- This offers a promising solution for specialized robotics and electronics in extreme environments.
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