Microstructure and Mechanical Properties of Aluminum Alloy Substrate Material Using Wire-Laser Directed Energy...

Heat accumulation during wire-laser directed energy deposition (WL-DED) may cause the thermal softening of thin aluminum alloy substrates. In this study, a liquid nitrogen-assisted cooling platform was introduced to regulate the substrate temperature during WL-DED of a 6061 aluminum alloy substrate with 5356 aluminum alloy wire. The results show that substrate cooling can mitigate substrate softening, and -100 °C provides improved substrate-bottom hardness while maintaining acceptable bonding quality. The hardness variation is discussed in relation to reduced thermal exposure, grain-size variation, recrystallization behavior, and the possible retention of strengthening phases. This work establishes a preliminary basis for tailoring the local properties of thin aluminum alloy substrates in WL-DED. Since the substrate is not removed, but forms an integrated component of the final assembly along with the deposited material, its properties are critical to component performance. This integrated approach also enhances material utilization and streamlines production by eliminating substrate separation steps.