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Two-Way Shape Memory Micropillar Arrays Enabling Efficient and Continuous Switchable Adhesion for Microparticle
Jing Luo1, Rong-Rong Cai2, Li-Zhi Zhang2
1School of Chemistry and Chemical Engineering, South China University of Technology, Guangzhou, People's Republic of China.
Small (Weinheim an Der Bergstrasse, Germany)
|July 29, 2026
Summary
Researchers developed a novel shape-memory micropillar array for precise micro-object manipulation. This smart surface offers switchable adhesion, enabling efficient detachment and transport of microparticles for advanced applications.
Area of Science:
- Materials Science
- Robotics
- Nanotechnology
Background:
- Developing smart surfaces with controllable adhesion for micro-object manipulation is crucial for applications like electronics assembly and micro-delivery.
- Existing technologies face challenges in size-dependent detachment and continuous adhesion control.
Purpose of the Study:
- To propose and demonstrate a two-way shape-memory micropillar array (SMMA) based on liquid crystalline elastomers (LCEs) for switchable adhesion.
- To achieve efficient and controllable detachment and transport of micro-objects.
Main Methods:
- Fabrication of a two-way shape-memory micropillar array using liquid crystalline elastomers (LCEs).
- Utilizing thermal stimulation for reversible switching between upright and collapsed pillar states.
- Implementing a heat-load-shear-pull (HLSP) protocol for microparticle detachment.
Main Results:
- The SMMA demonstrated reversible, continuous switching of adhesion under thermal control.
- Achieved efficient in situ self-driven detachment of microparticles larger than pillar spacing.
- The HLSP protocol yielded a 90.6% detachment efficiency for glass microparticles comparable to pillar spacing, with adaptability to various materials and sizes.
Conclusions:
- Shape-memory-assisted shear adhesion offers a programmable method for precise micro-object manipulation.
- The developed SMMA and HLSP protocol enable flexible transport and handling of microparticles.
- This technology holds promise for high-precision microelectronics assembly and targeted micro-delivery systems.

