Related Experiment Video
Updated: Aug 5, 2026

08:21
Quantitative Hardness Measurement by Instrumented AFM-indentation
Published on: November 22, 2016
Deep Indentation of Soft Thin Films Beyond the 10% Rule
1Peking University, School of Mechanics and Engineering Science, State Key Laboratory for Turbulence and Complex Systems, Beijing 100871, China.
Physical Review Letters
|July 31, 2026
Summary
Deep indentation of thin films, previously avoided, offers new insights into material stiffness. This study reveals a simple force-depth relation and a pull-off force independent of material properties, simplifying analysis for ultrathin films.
Area of Science:
- Materials Science
- Mechanics of Materials
- Nanotechnology
Background:
- Indentation is a common method for measuring material stiffness.
- Substrate effects can significantly artifactually increase the apparent stiffness of thin films.
- The empirical 10% rule of thumb for indentation depth is unreliable for ultrathin films.
Purpose of the Study:
- To explore the mechanics of thin films under deep indentation, a regime traditionally avoided.
- To develop a theoretical framework for interpreting indentation in this deep regime.
- To provide a more accessible experimental method for characterizing ultrathin films.
Main Methods:
- Development of an asymptotic theory incorporating nonlinear geometry and elasticity.
- Analysis of indentation force-depth relationships in the deep indentation regime.
- Investigation of pull-off force behavior under deep indentation.
Main Results:
- A simple indentation force-depth relation was elucidated for deep indentation.
- The pull-off force was found to be independent of material law and geometric nonlinearity.
- The study provides a unified framework for interpreting deep indentation of thin films.
Conclusions:
- Deep indentation offers a viable and accessible method for characterizing thin film mechanics, especially for ultrathin films.
- The established theoretical framework simplifies the interpretation of experimental data in this regime.
- This work overcomes limitations of traditional indentation methods for thin films.

