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Updated: Aug 6, 2026

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
Robust Transparent Conductive Fibers Enabled by Ag-S Covalent Bonding Interface
Kainan Hong1, Yutao Lu1, Fuyao Huang1
1State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Institute of Fiber Materials and Devices, and Laboratory of Advanced Materials, Fudan University, Shanghai, China.
Abstract:
Electronic textile is a promising platform for next-generation wearable systems, where transparent conductive fibers are essential building blocks for optoelectronic functions. Current transparent conductive fibers are typically realized by coating conductive nanomaterials onto a polymer fiber substrate. However, this strategy generally suffers from weak interfacial adhesion and thus causes conductivity degradation under mechanical deformations or environmental exposure. In this work, we report a high-performance transparent conductive fiber based on disulfide-functionalized thermoplastic polyurethane. Silver nanowires (AgNWs) react with sulfur atoms in the disulfide groups to form robust Ag-S covalent linkages, thereby stabilizing the AgNWs network. The resulting fibers exhibit a balanced combination of high conductivity (2.7 × 103 S/m) and optical transmittance (81%). Their conductivity and optical transmittance can be tuned by adjusting the AgNWs loading, while maintaining high transparency and superior mechanical durability under harsh conditions, including 1000 cycles of bending, twisting, and abrasion. We further integrate these fibers into electroluminescent fibers and display textiles through wrapping or weaving. These devices exhibit high brightness, uniform emission, and long-term operational stability. This interfacial engineering strategy improves compatibility between conductive networks and flexible polymers, enabling high-performance electronic fibers and textiles.

