A Highly Conductive 3D Interconnected Framework with Stress Buffering for Enhanced Electrochemical and Mechanical

Moxuan Wang1, Jinghan Zuo1, Xiaokang Gu1

  • 1School of Materials Science and Engineering, Beihang University, Beijing100191, PR China.

Nano Letters
|August 12, 2026
PubMed
Abstract

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