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Preparation and Reactivity of Gasless Nanostructured Energetic Materials
Published on: April 2, 2015
Refractory Nitride, Resilient PCM: Titanium Nitride/RT70 HC Nanocomposites for Medium-Temperature Thermal Energy
Elshan Sefidgar Shahanaghi1,2, Yasin Varol1, Ezgi Gürgenç3
1Department of Automotive Engineering, Faculty of Technology, Fırat University, 23119 Elazig, Türkiye.
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This study tailors titanium nitride (TiN)-reinforced RT70 HC nanocomposite phase change materials (PCMs) for medium-temperature thermal energy storage. TiN nanoparticles were incorporated into commercial RT70 HC at 0.1-2.0 wt.% by a two-stage method combining sodium dodecyl sulfate, magnetic stirring, and ultrasonication, and characterized by FT-IR, XRD, SEM-EDX, elemental mapping, DSC, thermal conductivity, Cp, TGA, and 1000-cycle tests. FT-IR and XRD confirmed the physical integration of TiN into RT70 HC without new chemical bonds or secondary phases, and SEM-EDX showed a concentration-dependent dispersion. The phase change temperatures were largely preserved. The latent heat varied non-monotonically with TiN content, increasing at low loadings (0.1-0.5 wt.%) and decreasing at higher loadings. Because each composition was prepared as a single batch and measured on small specimens, the low-loading latent-heat increase (up to about 9%) is indicative rather than statistically proven and may fall within the subsampling variance. The 0.5 wt.% sample reached the highest values of 306/296 J/g in the first cycle and 286/268 J/g after 1000 cycles. The thermal conductivity increased with TiN content, reaching a maximum enhancement of about 24.09% in the liquid phase (0.1785 to 0.2215 W/(m·K) at 80 °C) and 35.7% in the solid phase at 2.0 wt.%, whereas the specific heat capacity was lower at higher loadings, an indicative trade-off given the single-run measurement uncertainty. TGA showed degradation onset temperatures above 240 °C, a wide safety margin relative to the ~72 °C working range. Overall, the 0.1-0.5 wt.% formulations offered the most balanced thermal performance for medium-temperature applications.

