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Published on: November 28, 2017
Comprehensive Review on Doping Strategies for Two-Dimensional Tungsten Diselenide
1Department of Chemistry, Kookmin University, Seoul 02707, Republic of Korea.
International Journal of Molecular Sciences
|August 13, 2026
Summary
Controlled doping of tungsten diselenide (WSe2) is crucial for advanced electronics. This review details methods to overcome doping challenges in WSe2, enabling improved transistor performance and logic circuits.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Two-dimensional transition metal dichalcogenides, like tungsten diselenide (WSe2), are promising for beyond-silicon electronics due to their atomic thickness and strong electrostatic control.
- WSe2 offers ambipolar transport but faces limitations like Fermi-level pinning, contact-dominated injection, and defect variability, necessitating controlled doping.
Purpose of the Study:
- To review doping strategies for WSe2 compatible with atomically thin van der Waals semiconductors.
- To analyze thermodynamic mechanisms, doping selectivity, and trade-offs in doping WSe2.
- To discuss the impact of doping on device performance and identify future challenges.
Main Methods:
- Surface charge-transfer doping using molecular adsorbates, Lewis acids, and alkali metals.
- Defect-mediated chemisorption, self-limiting oxide interfacial layers, and in situ vacancy engineering.
- Analysis of thermodynamic mechanisms, contact-selective vs. channel-selective doping, and degenerate vs. non-degenerate doping.
Main Results:
- Doping strategies effectively address Fermi-level pinning and improve carrier injection in WSe2 transistors.
- Doping enables Schottky-barrier narrowing, threshold-voltage control, and apparent mobility enhancement.
- Controlled doping has facilitated the development of complementary metal-oxide-semiconductor logic circuits using WSe2.
Conclusions:
- Controlled doping is essential for unlocking the full potential of WSe2 in next-generation electronics.
- Remaining challenges include air stability, selective-area patterning, scalable synthesis, and low-temperature integration for 3D devices.

