Analysis of the Influence Water Drop's Initial Temperature on the Intensity of Heat Dissipation from the Heat...

In recent years, the size of integrated circuits has been rapidly decreasing. At the same time, their power and heat generation have been increasing. In such conditions, it is important to maintain the right temperature to ensure that the devices operate stably. This necessitates the development of effective methods for heat removal from loaded components of electronic systems. Drip cooling of heated surfaces is currently a promising area in the management of thermal conditions of electronic systems. It is assumed that this method of heat dissipation significantly increases the efficiency of heat dissipation, reduces the thermal load on components, and ensures reliable operation of microdevices in extreme operating conditions. However, a recent analysis of the cooling process of a heated heat sink surface by single droplets showed that such a cooling system is not very effective. To intensify the cooling process of heated heat sink plates, researchers from all countries are developing additional approaches to accelerate the heat removal process from electronic components. The latter includes varying the initial temperature of the cooling liquid droplet (e.g., water) evaporating from the heat sink surface. However, until now, practically no analysis has been conducted based on experimental and theoretical studies on the influence of the initial droplet temperature on the characteristics and conditions of the heat sink surface cooling process. Therefore, the aim of this work was an experimental and theoretical assessment of the influence of the initial temperature of a water droplet on the characteristics and conditions of the cooling process of the near-surface layer of a plate (a model heat sink surface) when varying the initial droplet temperature in the range from 280 to 300 K. As a result of the experiments, it was found that a decrease in the initial temperature leads, as expected, to an intensification of the heated surface cooling process. However, the overall effect of intensifying the cooling process of the near-surface layer of the heated heat sink plate is relatively small and does not exceed 2-4 degrees. The main conclusion is that the droplet maintains a stable temperature on the heated surface, but it cannot significantly reduce it.