Related Experiment Video
Updated: Aug 23, 2026

Fabrication and Characterization of Thickness Mode Piezoelectric Devices for Atomization and Acoustofluidics
Published on: August 5, 2020
Design of a high-sensitivity wideband ultrasonic transducer with an ultra-high acoustic-impedance backing
Yiqi Cai1, Sanxin Gui1, Jifeng Li1
1College of Mechanical and Vehicle Engineering, Changsha University of Science and Technology, Changsha 410114, China; Hunan Province University Key Laboratory of Intelligent Testing and Control Technology for Engineering Equipment, Changsha 410114, China.
Abstract:
Ultrasonic transducers are the key components for acoustic transmission and reception. High-quality ultrasonic imaging requires both high sensitivity and broad bandwidth. However, the conventional transducer structures face an intrinsic trade-off between sensitivity and bandwidth and therefore rarely achieve both simultaneously. This work presents a transducer design that attains high sensitivity and wide bandwidth concurrently by combining a dual-layer front matching network, a 1-3 piezoelectric composite active layer, and an ultra-high acoustic-impedance backing structure (UHAIBS). The UHAIBS alters the boundary condition of the piezoelectric layer so that most acoustic energy is efficiently utilized. Finite element simulations indicate a sensitivity increase of ≈3.88 dB and a bandwidth expansion from 71.2% to 83.5% relative to a conventional structure. A prototype was fabricated and experimentally characterized; measurements confirm the design's high-sensitivity and wideband behavior and validate imaging performance in a phantom. The proposed design offers a practical route to high-performance ultrasonic transducers for medical imaging and industrial nondestructive testing.

