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A Simple and Efficient Protocol for the Catalytic Insertion Polymerization of Functional Norbornenes
Published on: February 27, 2017
A Norbornene-Derived Epoxy/Cyanate Ester System with Enhanced Thermal and Dielectric Properties as Electronic
Peng Zhao1, Jianming Zhang1, Li Li1
1Institution of Quantum and Sustainable Technology (IQST), School of Chemistry and Chemical Engineering, Jiangsu University, 301 Xuefu Road, Zhenjiang 212013, China.
Abstract:
In this work, to meet the requirements of high-performance electronic devices for high-frequency/speed telecommunication and semiconductor packaging, we developed a norbornene (NB)-backboned epoxy/cyanate ester compound system to modify the commercial bisphenol-A (BPA) diglycidyl ether (DGEBA) epoxy resin. A norbornene-based epoxy monomer (ENBDE) and cyanate ester (ENBCY) were synthesized using 5-ethylidene-2-norbornene (ENB) as the key starting material. The ENBDE was blended with DGEBA as the epoxy resin compound, which was cured using ENBCY as the curing agent to form a cross-linked thermoset. The effect of ENBDE content on thermal stability, mechanical properties, dielectric performance, and bonding strength of the thermosets was investigated. The optimized formula showed a significantly improved thermal stability of the cured resin with a glass-transition temperature of 249.2 °C and a 5% weight-loss temperature (T5%) of 351.5 °C; the dielectric constant and dissipation factor at a high frequency of 10 GHz were measured to be as small as 2.57 and 0.0068, respectively, showcasing great potential as a high-performance dielectric epoxy material for high-frequency/speed electronic applications.
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