Gallium-Based Liquid Metal Microcapsule Composites: A Synergistic Solution to the Challenges of Heat Dissipation,...

The miniaturization and high-frequency development of electronic devices demand advanced packaging materials that simultaneously possess improved thermal conductivity, notable electromagnetic interference shielding effectiveness, and reliable electrical insulation. Although liquid metals exhibit superior thermal and electrical conductivity, their potential leakage may cause environmental contamination and corrosion of electronic components. Aiming at this dilemma, we designed novel liquid metal microcapsule composites. The composite features Ga-In alloy droplets encapsulated within poly(urea-formaldehyde) shells, which effectively harness the advantageous properties of liquid metals while preventing leakage risks and providing electrical insulation through the polymeric coating. Four microcapsules with different particle sizes (10.6, 9.8, 8.6, and 7.6 μm) were prepared, and LMMCS were synthesized. Comprehensive characterization revealed that, the composite containing 60 wt% of 9.8 μm microcapsules exhibited optimal thermal conductivity (0.527 W·m^-1·K^-1). The 60 wt% 7.6 μm composite demonstrated the highest volume resistivity (8.99 × 10¹¹ Ω·cm). EMI shielding effectiveness increased with microcapsule loading, while showing non-monotonic diameter dependence at a fixed 60 wt% concentration. Beyond conventional shielding mechanisms, we developed a microcapacitor model that elucidates the size-dependent interfacial polarization and multiple reflection phenomena. This study provides insights for the design of advanced electronic packaging materials, although further reliability and durability tests are needed to validate practical applicability.