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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Mitigating tin ion migration and reinforcing buried interface via synergistic polymer-modified tin oxide
Wenxin Yang1, Yepin Zhao2, Zhen-Yang Suo3
1Department of Materials Science and Engineering, University of California, Los Angeles, CA, USA.
Abstract:
The buried interface between the charge transport layer and the overlying perovskite absorber is critical yet difficult to probe in perovskite solar cells. Because light enters through the transparent substrate and is predominantly absorbed near this region, photo-induced degradation processes are partially initiated at the hidden buried interface. Here, we reveal that instability at the buried SnO2/perovskite interface triggers structural and chemical decomposition of the perovskite layer. To address this issue, we introduce polymeric interlayers that simultaneously reinforce interfacial bonding and suppress tin-ion migration. Poly(1-ethenylpyrrolidine-2,5-dione) (PED) forms a robust and chemically compatible interface, yielding enhanced phase purity, reduced defect density, and significantly mitigated tin diffusion. These findings identify the buried SnO2/perovskite interface as a key degradation-sensitive region under light aging and highlight interfacial polymer design as an effective strategy for improving the intrinsic stability of perovskite photovoltaics.