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Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices
Published on: December 7, 2017
Solution-Shearing Self-Assembly of Hydrothermally Synthesized Tellurium Nanowires for Fabricating Field-Effect
Hao Yang1,2, Mose Park3, Yanjin Tang3
1School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.
Abstract:
Tellurium nanowires (TeNWs), a typical p-type semiconductor, have attracted significant attention in field-effect transistors (FETs) due to their narrow bandgap and high carrier mobility properties. However, fabricating large-area electronic devices with uniform performance remains a major challenge. In this study, we report a facile solution-shearing self-assembling strategy for fabricating TeNW-FETs with high-performance and uniformity. The solution-shearing process occurs at the interface during relative motion between the substrate and TeNW dispersion, enabling the TeNWs to reorient and adhere to the substrate, forming a uniform nanowire network. The transfer characteristics of TeNW-FETs reveal highly uniform electrical performance, and FET performance is strongly modulated by dispersion concentrations. Moreover, we investigated the impact of the solution-shearing direction on the device performance. The effective field-effect mobility of FETs with channels perpendicular to the substrate movement direction was approximately 12.1% lower than that of FETs with channels parallel to the movement direction. To further demonstrate scalability, we fabricated transistor arrays containing 324 individual FETs on a 4-inch Si/SiO2 wafer, achieving 100% functional device yield and good performance uniformity. The devices exhibited an average ION/OFF ratio of 6.9 × 102, mobility (μeff) of 24.3 cm2 V-1 s-1, subthreshold swing (SS) of 7.9 V dec-1 and threshold voltage (VTH) of 12.0 V.

