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Influence of primers containing cupric ion on bonding of dentin treated with phosphoric acid
1Institute for Medical and Dental Engineering, Tokyo Medical and Dental University, Japan.
Abstract:
A primer containing cupric [Cu (II)] ions that promoted the interfacial initiation of polymerization from dentin surfaces was studied. Bovine dentin surfaces were treated with 10% phosphoric acid, then with a Cu primer consisting of aqueous 35% 2-hydroxyethyl methacrylate (HEMA) containing 0.03% cupric salt, and finally bonded with 4-META/MMA-PMMA resin initiated with oxidized tributylborane (TBBO). The use of the Cu primer resulted in a mean bond strength of 12.5 MPa compared with 3.8 MPa without the primer and 6.3 MPa using a 35% HEMA primer without Cu. The Cu primer produced a bond strength of 13.5 MPa even without 4-META in the resin system. Use of the Cu primer should simplify the bonding procedure since enamel and dentin can be etched simultaneously with 10% phosphoric acid.