Evaluation of water durability at adhesion interfaces by peeling test of resin film

The water durability at adhesion interfaces was investigated by measurement of the peeled area of thin resin films bonded with 4-META resin on metal surfaces after imposing thermal stress using liquid nitrogen. Thermal stress at the adhesion interface was calculated by a computer-aided finite element method. On 18-8 stainless-steel specimens which bond strongly with 4-META resin, total interface failure occurs on specimens with resin thicker than 0.55 mm in dry condition. A resin layer of 0.25 mm was chosen to study degradation of the adhesion interface by water. The shearing stress was calculated as 16 MPa for a 0.25 mm thick resin layer. On mild-steel adherent interface with 4-META resin which degrades rapidly by water molecule, the relationship between water immersion time and degradation at the adhesion interface was discussed together with the amount of water penetrated at the interface. The method proposed in the present study is effective as a quick evaluation method for water durability at the adhesion interface.