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Evaluation of interfacial bond strengths between amalgam and composite inlay
A H Abdel-Aziz1, H A Alhadainy
1Department of Restorative Dentistry, College of Dentistry, University of Tanta, Egypt.
Purpose:
To evaluate the interfacial bond strengths between two amalgam alloys and an inlay resin composite bonded with two different luting agents.
Materials And Methods:
Inlay composites (EOS) were bonded with two different bonding systems (Geristore, All-Bond 2) to high- or low-copper amalgams (Valiant, Agestan). All tested specimens were thermocycled (100 cycles), tested for tensile bond strength and compared by ANOVA (P < 0.05).
Results:
Bond strengths varied from 5.3 to 11.4 MPa, with Geristore bonded to high-copper amalgam providing the highest strength.
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