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Physical Review Letters|March 24, 2020
Secondary-Phase-Assisted Grain Boundary Migration in CuInSe_{2}Chen Li, Ekin Simsek Sanli, Daniel Barragan-Yani, et al.
Advanced Materials (Deerfield Beach, Fla.)|August 20, 2022
Crystalline Lattice-Confined Atomic Pt in Metal Carbides to Match Electronic Structures and Hydrogen Evolution Behaviors of PlatinumTian Ma, Hao Cao, Shuang Li, et al.
The Journal of Physical Chemistry. B|July 21, 2006
1s2p resonant inelastic X-ray scattering of iron oxidesFrank M F de Groot, Pieter Glatzel, Uwe Bergmann, et al.
ACS Applied Materials & Interfaces|June 22, 2018
High-Temperature Thermoelectricity in LaNiO<sub>3</sub>-La<sub>2</sub>CuO<sub>4</sub> HeterostructuresPinar Kaya, Giuliano Gregori, Federico Baiutti, et al.
Science Advances|December 3, 2021
Topotactic transformation of single crystals: From perovskite to infinite-layer nickelatesPascal Puphal, Yu-Mi Wu, Katrin Fürsich, et al.
ACS Applied Materials & Interfaces|April 28, 2025
Metal Phosphorus Chalcogenide Nanosheet-Modified SnO<sub>2</sub> Electron Transport Layers for Efficient Perovskite Solar CellsZhizhi Wang, Honglei Wang, Wei Wan, et al.
Frontiers in Chemistry|November 16, 2020
Hollow Mesoporous Carbon Spheres for High Performance Symmetrical and Aqueous Zinc-Ion Hybrid SupercapacitorSihan Chen, Gaoqi Yang, Xiaojuan Zhao, et al.
Nanomaterials (Basel, Switzerland)|April 30, 2020
Structural, Electronic and Magnetic Properties of a Few Nanometer-Thick Superconducting NdBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub> FilmsMarco Moretti Sala, Marco Salluzzo, Matteo Minola, et al.
Angewandte Chemie (International Ed. in English)|February 6, 2023
Exfoliated 2D Layered and Nonlayered Metal Phosphorous Trichalcogenides Nanosheets as Promising Electrocatalysts for CO<sub>2</sub> ReductionHonglei Wang, Yunfei Jiao, Bing Wu, et al.
ACS Catalysis|July 8, 2022
Who Does the Job? How Copper Can Replace Noble Metals in Sustainable Catalysis by the Formation of Copper-Mixed Oxide InterfacesChristoph W Thurner, Nicolas Bonmassar, Daniel Winkler, et al.
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