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The Journal of Physical Chemistry Letters
|
August 12, 2015
Understanding the Dual Nature of the Filament Dissolution in Conductive Bridging Devices
Umberto Celano, Ludovic Goux, Attilio Belmonte, et al.
Nanoscale
|
October 2, 2013
Switching mechanism and reverse engineering of low-power Cu-based resistive switching devices
Umberto Celano, Ludovic Goux, Karl Opsomer, et al.
Faraday Discussions
|
October 23, 2018
Key material parameters driving CBRAM device performances
Ludovic Goux, Janaki Radhakrishnan, Attilio Belmonte, et al.
Nano Letters
|
April 12, 2014
Three-dimensional observation of the conductive filament in nanoscaled resistive memory devices
Umberto Celano, Ludovic Goux, Attilio Belmonte, et al.
ACS Applied Materials & Interfaces
|
July 26, 2024
Improvement of the Ferroelectric Response of La-Doped Hafnium Zirconium Oxide Employing Tungsten Oxide Interfacial Layer with Back-End-of-Line Compatibility
Dae Seon Kwon, Jasper Bizindavyi, Gourab De, et al.
ACS Applied Materials & Interfaces
|
July 6, 2013
Influence of carbon alloying on the thermal stability and resistive switching behavior of copper-telluride based CBRAM cells
Wouter Devulder, Karl Opsomer, Felix Seidel, et al.
Micromachines
|
September 28, 2021
Understanding the Origin of Metal Gate Work Function Shift and Its Impact on Erase Performance in 3D NAND Flash Memories
Sivaramakrishnan Ramesh, Arjun Ajaykumar, Lars-Åke Ragnarsson, et al.
Scientific Reports
|
November 13, 2022
Device modeling of two-steps oxygen anneal-based submicron InGaZnO back-end-of-line field-effect transistor enabling short-channel effects suppression
Donguk Kim, Je-Hyuk Kim, Woo Sik Choi, et al.
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of 1
Search research articles
Search
Showing results (1-10 of 8) with videos related to
Sort By:
Page
of 1
The Journal of Physical Chemistry Letters
|
August 12, 2015
Understanding the Dual Nature of the Filament Dissolution in Conductive Bridging Devices
Umberto Celano, Ludovic Goux, Attilio Belmonte, et al.
Nanoscale
|
October 2, 2013
Switching mechanism and reverse engineering of low-power Cu-based resistive switching devices
Umberto Celano, Ludovic Goux, Karl Opsomer, et al.
Faraday Discussions
|
October 23, 2018
Key material parameters driving CBRAM device performances
Ludovic Goux, Janaki Radhakrishnan, Attilio Belmonte, et al.
Nano Letters
|
April 12, 2014
Three-dimensional observation of the conductive filament in nanoscaled resistive memory devices
Umberto Celano, Ludovic Goux, Attilio Belmonte, et al.
ACS Applied Materials & Interfaces
|
July 26, 2024
Improvement of the Ferroelectric Response of La-Doped Hafnium Zirconium Oxide Employing Tungsten Oxide Interfacial Layer with Back-End-of-Line Compatibility
Dae Seon Kwon, Jasper Bizindavyi, Gourab De, et al.
ACS Applied Materials & Interfaces
|
July 6, 2013
Influence of carbon alloying on the thermal stability and resistive switching behavior of copper-telluride based CBRAM cells
Wouter Devulder, Karl Opsomer, Felix Seidel, et al.
Micromachines
|
September 28, 2021
Understanding the Origin of Metal Gate Work Function Shift and Its Impact on Erase Performance in 3D NAND Flash Memories
Sivaramakrishnan Ramesh, Arjun Ajaykumar, Lars-Åke Ragnarsson, et al.
Scientific Reports
|
November 13, 2022
Device modeling of two-steps oxygen anneal-based submicron InGaZnO back-end-of-line field-effect transistor enabling short-channel effects suppression
Donguk Kim, Je-Hyuk Kim, Woo Sik Choi, et al.
Page
of 1