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RSC Advances|January 30, 2026
First-principles screening of dopants for high-conductivity graphene/copper interfacesXinsi Zhao, Boan Zhong, Baixue Bian, et al.
Chemsuschem|September 4, 2024
Oxygen-doped FeP on Ti Foil with Ti<sub>3</sub>O Interlayer for Efficient and Durable ElectrolysisYanqi Yuan, Boan Zhong, Kun Wang, et al.
Nano Letters|April 23, 2024
Characterizing Local Electronic States of Twin Boundaries in CopperJiamiao Ni, Lin Cao, Boan Zhong, et al.
Materials (Basel, Switzerland)|April 13, 2024
Effect of Copper Surface Roughness on the High-Temperature Structural Stability of Single-Layer-GrapheneSongsong Yao, Boan Zhong, Chongxiao Guo, et al.
ACS Applied Materials & Interfaces|July 25, 2022
Graphene Layer Number-Dependent Heat Transport across Nickel/Graphene/Nickel InterfacesJing Zhou, Kunming Yang, Bihuan Yang, et al.
ACS Applied Materials & Interfaces|July 21, 2025
Ultralow Resistivity of Copper Nanofilms Enhanced by Cubic Boron Nitride Coherent InterfaceJiamiao Ni, Naiqi Chen, Boan Zhong, et al.
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