Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Chang-Chun Lee

Showing results (1-10 of 36) with videos related to

Pageof 4
Sort By:
Materials (Basel, Switzerland)|October 25, 2017
Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling TestsChang-Chun Lee
Journal of Nanoscience and Nanotechnology|September 13, 2012
Strain engineering of nanoscale Si P-type metal-oxide-semiconductor field-effect transistor devices with SiGe alloy integrated with contact-etch-stop layer stressorsChang-Chun Lee
Journal of Nanoscience and Nanotechnology|August 7, 2019
Comprehensive Stress Effect of Thin Coatings and Silicon-Carbon Lattice Mismatch on Nano-Scaled Transistors with Protruding Poly GateChang-Chun Lee, Pei-Chen Huang
Materials (Basel, Switzerland)|September 28, 2021
Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling TechniquePei-Chen Huang, Chang-Chun Lee
Journal of Nanoscience and Nanotechnology|September 13, 2012
Stress impact of a tensile contact etch stop layer on nanoscale strained NMOSFETs embedded with a silicon-carbon alloy stressorChang-Chun Lee, Shu-Tong Chang
Molecules (Basel, Switzerland)|November 6, 2020
Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element SimulationChang-Chun Lee, Jing-Yan He
Biophysical Journal|February 16, 2011
Adhesion and merging of lipid bilayers: a method for measuring the free energy of adhesion and hemifusionYen Sun, Chang-Chun Lee, Huey W Huang
Biophysical Journal|March 13, 2012
How type II diabetes-related islet amyloid polypeptide damages lipid bilayersChang-Chun Lee, Yen Sun, Huey W Huang
Biophysical Journal|May 21, 2010
Membrane-mediated peptide conformation change from alpha-monomers to beta-aggregatesChang-Chun Lee, Yen Sun, Huey W Huang
Materials (Basel, Switzerland)|August 5, 2017
Flexural Capability of Patterned Transparent Conductive Substrate by Performing Electrical Measurements and Stress SimulationsChang-Chun Lee, Pei-Chen Huang, Ko-Shun Wang
Pageof 4

Showing results (1-10 of 36) with videos related to

Sort By:
Pageof 4
Materials (Basel, Switzerland)|October 25, 2017
Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling TestsChang-Chun Lee
Journal of Nanoscience and Nanotechnology|September 13, 2012
Strain engineering of nanoscale Si P-type metal-oxide-semiconductor field-effect transistor devices with SiGe alloy integrated with contact-etch-stop layer stressorsChang-Chun Lee
Journal of Nanoscience and Nanotechnology|August 7, 2019
Comprehensive Stress Effect of Thin Coatings and Silicon-Carbon Lattice Mismatch on Nano-Scaled Transistors with Protruding Poly GateChang-Chun Lee, Pei-Chen Huang
Materials (Basel, Switzerland)|September 28, 2021
Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling TechniquePei-Chen Huang, Chang-Chun Lee
Journal of Nanoscience and Nanotechnology|September 13, 2012
Stress impact of a tensile contact etch stop layer on nanoscale strained NMOSFETs embedded with a silicon-carbon alloy stressorChang-Chun Lee, Shu-Tong Chang
Molecules (Basel, Switzerland)|November 6, 2020
Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element SimulationChang-Chun Lee, Jing-Yan He
Biophysical Journal|February 16, 2011
Adhesion and merging of lipid bilayers: a method for measuring the free energy of adhesion and hemifusionYen Sun, Chang-Chun Lee, Huey W Huang
Biophysical Journal|March 13, 2012
How type II diabetes-related islet amyloid polypeptide damages lipid bilayersChang-Chun Lee, Yen Sun, Huey W Huang
Biophysical Journal|May 21, 2010
Membrane-mediated peptide conformation change from alpha-monomers to beta-aggregatesChang-Chun Lee, Yen Sun, Huey W Huang
Materials (Basel, Switzerland)|August 5, 2017
Flexural Capability of Patterned Transparent Conductive Substrate by Performing Electrical Measurements and Stress SimulationsChang-Chun Lee, Pei-Chen Huang, Ko-Shun Wang
Pageof 4