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ACS Applied Materials & Interfaces
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September 28, 2023
MoS<sub>2</sub> as an Effective Cu Diffusion Barrier with a Back-End Compatible Process
Chi-Yuan Kuo, Ya-Ting Chang, Yu-Ting Huang, et al.
Nano Letters
|
January 31, 2024
Graphene-All-Around Cobalt Interconnect with a Back-End-of-Line Compatible Process
Chi-Yuan Kuo, Jia-Heng Zhu, Yun-Ping Chiu, et al.
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Search research articles
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Showing results (1-10 of 2) with videos related to
Sort By:
Page
of 1
ACS Applied Materials & Interfaces
|
September 28, 2023
MoS<sub>2</sub> as an Effective Cu Diffusion Barrier with a Back-End Compatible Process
Chi-Yuan Kuo, Ya-Ting Chang, Yu-Ting Huang, et al.
Nano Letters
|
January 31, 2024
Graphene-All-Around Cobalt Interconnect with a Back-End-of-Line Compatible Process
Chi-Yuan Kuo, Jia-Heng Zhu, Yun-Ping Chiu, et al.
Page
of 1