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Optics Express|November 14, 2024
Signal enhancement of the gas detection based on quartz-enhanced photothermal spectroscopy technologyJingqi Shi, Jing Zhao, Hengbiao Zhang, et al.
ACS Applied Materials & Interfaces|September 29, 2025
Strengthening Actuation of Liquid Crystal Elastomers via Double-Network Construction with Meshed FabricsRujun Yu, Wei Cai, Daming Chen, et al.
ACS Applied Materials & Interfaces|December 8, 2022
Graphite Nanoflake-Modified Mo2C with Ameliorated Interfacial Interaction as an Electrocatalyst for Hydrogen Evolution ReactionFangfei Lin, Benhui Lv, Haopeng Gao, et al.
ACS Applied Materials & Interfaces|December 10, 2025
Interfacial Engineering of a Lithiophilic Li-Ag-Zn Ternary Alloy Anode for Long-Life Garnet-Based Solid-State BatteriesPingmei Li, Yibo Liu, ShiYu Yu, et al.
Heliyon|October 25, 2023
Nonlinear dependence (on ionic strength, pH) of surface charge density and zeta potential in microchannel electrokinetic flowDaming Chen, Nicolas Arancibia-Miranda, Mauricio Escudey, et al.
Small (Weinheim an Der Bergstrasse, Germany)|September 5, 2024
Synergetic Effect of Mo-Doped and Oxygen Vacancies Endows Vanadium Oxide with High-Rate and Long-Life for Aqueous Zinc Ion BatteryDaming Chen, Ming Yang, Yang Ming, et al.
Plants (Basel, Switzerland)|August 28, 2025
Genome-Wide Identification of DREB Gene Family in Kiwifruit and Functional Characterization of Exogenous 5-ALA-Mediated Cold Tolerance via ROS Scavenging and Hormonal SignalingPing Tian, Daming Chen, Jiaqiong Wan, et al.
Small (Weinheim an Der Bergstrasse, Germany)|December 2, 2024
Enhancing Potassium-Ion Storage through Nanostructure Engineering and Ion-Doped: A Case Study of Cu2+-Doped Co0.85Se with Yolk-Shell StructureDaming Chen, Yang Ming, Wei Cai, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|November 21, 2025
Lightweight and High-Strength Carbon Bulk Preparation Via Low-Temperature Pressureless Sintering of Sugar-Derived CarbonChenlin Hou, Daming Chen, Mingyi Tan, et al.
Materials (Basel, Switzerland)|June 19, 2024
Enhancing Adhesion and Reducing Ohmic Contact through Nickel-Silicon Alloy Seed Layer in Electroplating Ni/Cu/AgZhao Wang, Haixia Liu, Daming Chen, et al.
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