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Materials (Basel, Switzerland)|September 14, 2024
Subgrain Size Modeling and Substructure Evolution in an AA1050 Aluminum Alloy during High-Temperature CompressionQi Yang, Tomasz Wojcik, Ernst Kozeschnik
Computational Materials Science|August 30, 2016
Atomistic and continuums modeling of cluster migration and coagulation in precipitation reactionsPiotr Warczok, Jaroslav Ženíšek, Ernst Kozeschnik
The Journal of Chemical Physics|March 10, 2019
An efficient method to reconstruct free energy profiles for diffusive processes in transition interface sampling and forward flux sampling simulationsLin Qin, Christoph Dellago, Ernst Kozeschnik
Nanomaterials (Basel, Switzerland)|March 12, 2024
Thermodynamic and Kinetic Simulations Used for the Study of the Influence of Precipitates on Thermophysical Properties in NiTiCu Alloys Obtained by Spark Plasma SinteringCristiana Diana Cirstea, Erwin Povoden-Karadeniz, Vasile Cirstea, et al.
Materials (Basel, Switzerland)|January 1, 2021
Simulation of Dynamic and Meta-Dynamic Recrystallization Behavior of Forged Alloy 718 Parts Using a Multi-Class Grain Size ModelChristian Gruber, Peter Raninger, Aleksandar Stanojevic, et al.
Nanomaterials (Basel, Switzerland)|May 13, 2023
Structure and Migration Mechanisms of Small Vacancy Clusters in Cu: A Combined EAM and DFT StudyVasileios Fotopoulos, David Mora-Fonz, Manuel Kleinbichler, et al.
Materials (Basel, Switzerland)|January 5, 2021
Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing PotentialGeorg Siroky, Elke Kraker, Jördis Rosc, et al.
Materials (Basel, Switzerland)|April 3, 2021
Thermodynamic Modelling and Microstructural Study of Z-Phase Formation in a Ta-Alloyed Martensitic SteelFlorian Riedlsperger, Bernadette Gsellmann, Erwin Povoden-Karadeniz, et al.
Materials (Basel, Switzerland)|April 5, 2020
Characterisation of a High-Performance Al-Zn-Mg-Cu Alloy Designed for Wire Arc Additive ManufacturingPaulo J Morais, Bianca Gomes, Pedro Santos, et al.
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