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Sensors (Basel, Switzerland)|August 29, 2024
Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level PackageDezhao Wang, Weihu Zhou, Zili Zhang, et al.
Optics Letters|February 15, 2024
Focal plane coincidence method for a multi-view telecentric 3D imaging systemDezhao Wang, Weihu Zhou, Zili Zhang, et al.
Applied Optics|March 17, 2022
Height measurement of microbumps using a white-light triangulation methodFanchang Meng, Zili Zhang, Yanhui Kang, et al.
Nature Communications|May 20, 2026
Click-like Aldol Polycondensation in air for plastic electronics and beyondHongru Chen, Hongyuan Fu, Xiaofan Shi, et al.
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