Showing results (1-10 of 23) with videos related to

Sort By:
Pageof 3
Research (Washington, D.C.)|August 13, 2020
Achieving High Thermoelectric Performance in Rare-Earth Element-Free CaMg2Bi2 with High Carrier Mobility and Ultralow Lattice Thermal ConductivityMuchun Guo, Fengkai Guo, Jianbo Zhu, et al.
IEEE Transactions on Neural Systems and Rehabilitation Engineering : a Publication of the IEEE Engineering in Medicine and Biology Society|November 24, 2025
A Multimodal Stimulation System for Conveying Diverse Feedback in Hand Prosthetics: Preliminary AssessmentZhikai Wei, Aiguo Song, Fengkai Guo, et al.
ACS Applied Materials & Interfaces|January 9, 2020
Enhanced Thermoelectric Properties of p-Type CaMg2Bi2 via a Synergistic Effect Originated from Zn and Alkali-Metal Co-dopingMuchun Guo, Fengkai Guo, Jianbo Zhu, et al.
ACS Applied Materials & Interfaces|February 26, 2020
Enhanced Thermoelectric and Mechanical Performance in n-Type Yb-Filled Skutterudites through Aluminum AlloyingDandan Qin, Bo Cui, Jianbo Zhu, et al.
Research (Washington, D.C.)|May 18, 2022
Electronic Orbital Alignment and Hierarchical Phonon Scattering Enabling High Thermoelectric Performance p-Type Mg3Sb2 Zintl CompoundsJinsuo Hu, Jianbo Zhu, Fengkai Guo, et al.
ACS Applied Materials & Interfaces|April 10, 2024
Synergistically Optimized Thermoelectric and Mechanical Properties of Mg3.2Bi1.5Sb0.5-SiC CompositesKuai Yu, Xingyan Dong, Yuke Zhu, et al.
Small (Weinheim an Der Bergstrasse, Germany)|September 10, 2023
Mechanism of Thermoelectric Performance Enhancement in CaMg2 Bi2 -Based Materials with Different Cation Site DopingMuchun Guo, Ming Liu, Jianbo Zhu, et al.
Small (Weinheim an Der Bergstrasse, Germany)|July 25, 2019
Simultaneous Boost of Power Factor and Figure-of-Merit in In-Cu Codoped SnTeFengkai Guo, Bo Cui, Huiyuan Geng, et al.
National Science Review|July 10, 2025
Revisiting thermoelectric transport properties through a band nonparabolicity factorJianbo Zhu, Ming Liu, Xingyan Dong, et al.
Nature Communications|July 20, 2026
Improving thermal shock resistance of segmented thermoelectric devices via metal foam integrationKuai Yu, Jiayue Du, Haoyang Tong, et al.
Pageof 3