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Frank G Shi

Showing results (1-10 of 6) with videos related to

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The Review of Scientific Instruments|December 7, 2007
A new switched-capacitor frequency modulated driver for light emitting diodesWeifeng Feng, Frank G Shi
Nanomaterials (Basel, Switzerland)|July 2, 2021
Electrical Interconnection and Bonding by Nano-LockingJielin Guo, Yu-Chou Shih, Frank G Shi
Optics Express|April 15, 2010
Light extraction enhanced white light-emitting diodes with multi-layered phosphor configurationJiun Pyng You, Nguyen T Tran, Frank G Shi
The Review of Scientific Instruments|May 2, 2008
A switched supply tunable red-green-blue light emitting diode driverWeifeng Feng, Frank G Shi, Yongzhi He, et al.
Applied Optics|October 28, 2006
Study of particle size effects on an optical fiber sensor response examined with Monte Carlo simulationNguyen T Tran, Chris G Campbell, Frank G Shi
Nanomaterials (Basel, Switzerland)|August 27, 2021
Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line ThicknessJielin Guo, Yu-Chou Shih, Roozbeh Sheikhi, et al.
Pageof 1

Showing results (1-10 of 6) with videos related to

Sort By:
Pageof 1
The Review of Scientific Instruments|December 7, 2007
A new switched-capacitor frequency modulated driver for light emitting diodesWeifeng Feng, Frank G Shi
Nanomaterials (Basel, Switzerland)|July 2, 2021
Electrical Interconnection and Bonding by Nano-LockingJielin Guo, Yu-Chou Shih, Frank G Shi
Optics Express|April 15, 2010
Light extraction enhanced white light-emitting diodes with multi-layered phosphor configurationJiun Pyng You, Nguyen T Tran, Frank G Shi
The Review of Scientific Instruments|May 2, 2008
A switched supply tunable red-green-blue light emitting diode driverWeifeng Feng, Frank G Shi, Yongzhi He, et al.
Applied Optics|October 28, 2006
Study of particle size effects on an optical fiber sensor response examined with Monte Carlo simulationNguyen T Tran, Chris G Campbell, Frank G Shi
Nanomaterials (Basel, Switzerland)|August 27, 2021
Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line ThicknessJielin Guo, Yu-Chou Shih, Roozbeh Sheikhi, et al.
Pageof 1